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OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks

Engineering at Meta

Oct 12, 2026

10/12/2026

Flattened Planar Fabric Shifts Fault Tolerance To Hosts And NICs In A Multiplane Two-Tier Clos GPU Fabric

OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks · Engineering at Meta

Science, Technology & Innovation · Oct 12, 2026

Meta’s Flattened Planar Fabric (FPF) uses eight independent 100G GPU-to-switch links and NIC packet spraying across network planes, with host software coordinating with switches to avoid failures. By flattening a three-tier Clos into two tiers, it aims to reduce latency, hops, and cost, but shifts fault tolerance and portability requirements onto coordinated GPU hosts, NICs, and network control systems.


10/12/2026

OSPA Standardization Aims To Streamline Switch Platform Bring-Up And Enable Vendor Self-Service Porting To Accelerate Hardware Adoption

OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks · Engineering at Meta

Science, Technology & Innovation · Oct 12, 2026

Meta, Microsoft, and Alibaba submitted OSPA v1.0 to the OCP to standardize switch-platform interfaces for hardware management, complementing SAI’s portable data-plane software. The specification and Meta’s self-service FBOSS onboarding aim to reduce duplicated engineering, maintenance costs, and hardware adoption time by enabling vendors to integrate platforms independently.


10/12/2026

Meta's BAG Orchestrates Cross-Region AI Training as a Single Cluster Through Real-Time Path Measurements and Adaptive Traffic Routing

OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks · Engineering at Meta

Science, Technology & Innovation · Oct 12, 2026

Meta’s Backend Aggregation layer is designed to unify geographically distributed facilities into one AI training cluster by measuring real path distances, dynamically sizing Ethernet buffers, balancing traffic by available capacity, and limiting costly cross-region collective communication.


10/12/2026

Meta Extends Ethernet Into Scale-Up Accelerator Racks Paving ESUN Standard Path And Enabling Shared Networking Tools And High-Density ESUN-Compliant Fabrics

OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks · Engineering at Meta

Science, Technology & Innovation · Oct 12, 2026

Meta is extending Ethernet into accelerator-rack scale-up networking: its Tahan system connects 16 MTIA 300 accelerators with Broadcom Tomahawk 5 switches using the same IPv6, PFC, QoS, and RoCE stack as scale-out networks, while a planned Tomahawk6C design will connect 72 accelerators and adopt OCP’s ESUN data plane. This points toward shared Ethernet operations across intra- and inter-rack fabrics, with competition shifting to ESUN compliance and dense implementations.


10/12/2026

102.4-Tbps Ethernet Switches Use Interoperable Silicon With Shared FBOSS Software Requiring Integrated Cooling And System Qualification

OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks · Engineering at Meta

Science, Technology & Innovation · Oct 12, 2026

Meta’s IcePack liquid-cooled rack brings 102.4-Tbps Ethernet switching into dense AI infrastructure, combining 128×800G IceCube blades, Broadcom or NVIDIA ASIC options, and shared FBOSS/SAI software; this makes power, cooling, rack design, and network software an integrated deployment concern.